10gm White thermal paste heat sink compound
This is a thermally conductive chemical compound. It is commonly used as an interface between the heat sink and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation. This paste does not add mechanical strength to the bond between the heat sink and heat source. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place. And to apply pressure, spread the thermal paste.
- Eliminate air gaps between the heat sink and heat source
- Maximize the heat transfer or dissipation
- Also, Eliminates the risk of melting of the heat sink