100ML White thermal paste heat sink compound Silicone base tube

100ML White thermal paste heat sink compound Silicone base tube

It is possible for this chemical compound to conduct heat. It is commonly used as an interface between the heat sink and heat sources, like high-power semiconductor devices. The main purpose of thermal paste is to improve heat transfer and dissipation by eliminating any voids or air gaps from the interface area. This paste does not mechanically strengthen the connection between the heat sink and the heat source. The heat sink needs to be used in conjunction with a mechanical fastening system, like screws, to stay in place. and apply pressure by spreading the thermal paste.

Features:-

• Remove any air spaces that exist between the heat source and the heat sink.
• Maximize the heat transfer or dissipation
• Also, Eliminates the risk of melting of the heat sink