10gm White thermal paste heat sink compound

10gm White thermal paste heat sink compound

This is a thermally conductive chemical compound. It is generally used as an interface between the heat sink and warmth sources which include excessive-energy semiconductor gadgets. The main role of thermal paste is to eliminate air gaps or areas from the interface location so one can maximize warmth transfer and dissipation. This paste does now not add mechanical strength to the bond between the warmth sink and heat source. It must be coupled with a mechanical fixation mechanism along with screws to keep the warmth sink in region. And to use stress, spread the thermal paste.

Features:-

1. Eliminate air gaps among the warmth sink and warmth source
2. Maximize the warmth transfer or dissipation
3. Also, Eliminates the chance of melting of the heat sink