- 100% pure Thermal grease compound
- Thermal conductivity : >1.93W/m-k
- Thermal resistance : <0.120°C-in²/W
- 20% metal oxide compounds
- Weight 0f the compound : 20gm
SKU: 63383HK
20gm Thermal grease heat sink compound
A material known as thermal grease, thermal paste, or thermal compound is frequently placed between a microprocessor and a heatsink to improve heat transmission between the two surfaces. To maximize heat transfer and dissipation, the primary function of thermal grease compound is to remove any air gaps or voids from the interface area. Because of its extremely high thermal conductivity, the mechanical heatsink's capacity is increased.
Features
- Low heat resistance
- High thermal conductivity
- High quality manufacturing
- Maximise heat transfer and dissipation
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