500g White thermal paste heat sink compound

500g White thermal paste heat sink compound

This chemical compound is distinguished by its thermal conductivity. For heat sinks and heat sources such as high-power semiconductor devices, it frequently serves as a point of connection. The primary function of thermal paste is to remove air gaps or voids from the interface area, hence improving heat transfer and dissipation. A thermal paste heat sink compound is used to enhance thermal transfer between the CPU and the heat sink. This chemical is widely used to increase the effectiveness and surface cooling capacity of the heat sink. This paste does not mechanically reinforce the connection between the heat sink and the heat source. To keep the heat sink in place, it needs to be attached to a mechanical fixation mechanism, like screws. After the thermal paste has been distributed, apply pressure. One substance that helps with the cooling and desiccation of electronic components is thermal paste. It is made up of a substance that surrounds the heat sink to absorb heat and prevent it from becoming too hot. The mechanical heatsink's efficiency is increased by its exceptionally high thermal conductivity.

Features:-

• Low heat resistance
• High-quality manufacturing
• High thermal conductivity
• Maximize the heat transfer or dissipation